Mold produced housing for enclosing the connection between a cable and a connector

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Description

FIG. 1 is a front elevational view of a mold produced housing for enclosing the connection between a cable and a connector showing my new design.

FIG. 2 is a rear elevational view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a left side elevational view thereof.

The broken lines in FIG. 1 are included for the purpose of illustrating environmental structure only and form no part of the claimed design.

Claims

The ornamental design for a mold produced housing for enclosing the connection between a cable and a connector, as shown and described.

Referenced Cited
U.S. Patent Documents
D378209 February 25, 1997 Morikawa et al.
D411175 June 22, 1999 Doren et al.
D424522 May 9, 2000 Nishio et al.
D425487 May 23, 2000 Lee
D429484 August 15, 2000 Nishio et al.
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D434381 November 28, 2000 Shimojyo
D434727 December 5, 2000 Huang
4990103 February 5, 1991 Sazaki et al.
5397246 March 14, 1995 Defibaugh et al.
5425657 June 20, 1995 Davis et al.
5683269 November 4, 1997 Davis et al.
6030258 February 29, 2000 Fumikura
6039606 March 21, 2000 Chiou
Patent History
Patent number: D448736
Type: Grant
Filed: Nov 10, 2000
Date of Patent: Oct 2, 2001
Inventor: Henry Milan (Rochester Hills, MI)
Primary Examiner: Joel Sincavage
Attorney, Agent or Law Firm: Marshall & Melhorn, LLC
Application Number: 29/132,484