Sputtering chamber coil
Latest Applied Materials, Inc. Patents:
- LINEAR ACCELERATOR ASSEMBLY INCLUDING FLEXIBLE HIGH-VOLTAGE CONNECTION
- LOW RESISTIVITY GAPFILL
- Semiconductor processing tool platform configuration with reduced footprint
- Optimized selector and memory element with electron barrier
- Lithography apparatus, patterning system, and method of patterning a layered structure
Description
FIG. 1 is a front elevational view;
FIG. 2 is a top view;
FIG. 3 is a right side elevational view;
FIG. 4 is a bottom view; and,
FIG. 5 is a rear elevational view of our sputtering chamber coil.
The left side elevation view (not shown) is the same as the right side elevational view (FIG. 3) because of coil symmetry.
Claims
The design for sputtering chamber coil, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
118252 | August 1871 | Lewis |
565698 | August 1896 | Sparks |
4154011 | May 15, 1979 | Rakestraw et al. |
4361472 | November 30, 1982 | Morrison, Jr. |
4478437 | October 23, 1984 | Skinner |
5001816 | March 26, 1991 | Oetiker |
5150503 | September 29, 1992 | Müller |
5429070 | July 4, 1995 | Campbell et al. |
5430355 | July 4, 1995 | Paranjpe |
5556501 | September 17, 1996 | Collins et al. |
5637961 | June 10, 1997 | Ishii et al. |
5669975 | September 23, 1997 | Ashtiani |
5681393 | October 28, 1997 | Takagi |
5683537 | November 4, 1997 | Ishii |
5707498 | January 13, 1998 | Ngan |
5721021 | February 24, 1998 | Tobe et al. |
5770098 | June 23, 1998 | Araki et al. |
5783492 | July 21, 1998 | Higuchi et al |
0653776 | October 1994 | EP |
0727923 | February 1996 | EP |
0758148 | August 1996 | EP |
0807954 | November 1997 | EP |
0813227 | December 1997 | EP |
0836218 | April 1998 | EP |
0836219 | April 1998 | EP |
0840351 | May 1998 | EP |
0727807 | September 1999 | EP |
- Search report in PCT/US98/10058 issued 4Nov98.
- U.S. Patent Application Serial No. 29/109,892 (Atty. Dkt. 3979D/PVD/DV).
- U.S. Patent Application Serial No. 29/109,870 (Atty. Dkt. 3980/PVD/DV).
- U.S. Patent Application Serial No. 29/109,893 (Atty. Dkt. 3981/PVD/DV).
- U.S Patent Application Serial No. 08/559,345 filed Nov. 15, 1995 (Atty Dkt 938.X1/4479).
- U.S. Patent Application Serial No. 08/730,722 filed Oct. 8, 1996 (Atty Dkt 1207/4784).
- U.S. Patent Application Serial No. 09/049,276 Mar. 27, 1998 (Atty Dkt 938.D2/5703).
- U.S. Patent Application Serial No. 09/049,839 Mar. 27, 1998 (Atty Dkt 938.D1/5702).
- Applied Materials, Inc., Exhibit A, Dated Prior to Jul. 13, 1998, the filing date of the present application.(Exhibit A is a drawing of a prior art coil design which is prior to the design of the present application.).
Patent History
Patent number: D450070
Type: Grant
Filed: Jul 13, 1998
Date of Patent: Nov 6, 2001
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Praburam Gopalraja (San Jose, CA), Zheng Xu (Foster City, CA), Michael Rosenstein (Sunnyvale, CA), John C. Forster (San Francisco, CA)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firm: Konrad Raynes & Victor
Application Number: 29/090,618
Type: Grant
Filed: Jul 13, 1998
Date of Patent: Nov 6, 2001
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Praburam Gopalraja (San Jose, CA), Zheng Xu (Foster City, CA), Michael Rosenstein (Sunnyvale, CA), John C. Forster (San Francisco, CA)
Primary Examiner: Antoine Duval Davis
Attorney, Agent or Law Firm: Konrad Raynes & Victor
Application Number: 29/090,618
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2)
International Classification: 1509;
International Classification: 1509;