Base for a heat dissipating assembly

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Description

FIG. 1 is a perspective view of a base for a heat dissipating assembly, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a base for a heat dissipating assembly, as shown.

Referenced Cited
U.S. Patent Documents
D315832 April 2, 1991 Rocheleau et al.
5368094 November 29, 1994 Hung
D357670 April 25, 1995 Dodson
5495392 February 27, 1996 Shen
6161611 December 19, 2000 Cheng
6246584 June 12, 2001 Lee et al.
D450044 November 6, 2001 Lindstrom
6373701 April 16, 2002 Lo
Patent History
Patent number: D465462
Type: Grant
Filed: Jul 24, 2001
Date of Patent: Nov 12, 2002
Inventor: Hsin-Mao Hsieh (Pingtung City, Pingtung Hsien)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Thorp Reed & Armstrong LLP
Application Number: 29/145,500
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;