Heat pipe of radiator of computer

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Description

FIG. 1 is a perspective view showing the heat pipe of radiator of computer of my new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view thereof shown exploded for ease of illustration.

Claims

The ornamental design for heat pipe of radiator of computer, shown and described.

Referenced Cited
U.S. Patent Documents
4019098 April 19, 1977 McCready et al.
4231423 November 4, 1980 Haslett
5285347 February 8, 1994 Fox et al.
5381859 January 17, 1995 Minakami et al.
5437328 August 1, 1995 Simons
D373572 September 10, 1996 Orton
5583317 December 10, 1996 Mennucci et al.
5719441 February 17, 1998 Larimer
D400188 October 27, 1998 Chu
5949648 September 7, 1999 Liao
6360813 March 26, 2002 Katoh et al.
Patent History
Patent number: D475354
Type: Grant
Filed: Dec 21, 2001
Date of Patent: Jun 3, 2003
Inventor: Tung-Yuan Wang (Tai-Shan Hsiang, Taipei Hsien)
Primary Examiner: Ted Shooman
Assistant Examiner: Selina Sikder
Application Number: 29/152,450
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;