Electronics component assembly
Latest Pulse Engineering, Inc. Patents:
Description
FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a side elevation view of a second embodiment of an electronics component package, showing our new design;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a front elevation view thereof.
The broken lines depict environmental structure and form no part of the claimed design.
Claims
The ornamental design of an electronics component assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
3638149 | January 1972 | Bopp et al. |
4292614 | September 29, 1981 | Ono et al. |
4507633 | March 26, 1985 | Minks |
4924213 | May 8, 1990 | Decho et al. |
5438307 | August 1, 1995 | Chou |
5801930 | September 1, 1998 | Dittmann |
6549108 | April 15, 2003 | Fausch |
- Allied Electronics, 1990, pp. 402 (upper left), 615 (upper right and middle left).
Patent History
Patent number: D485536
Type: Grant
Filed: Mar 10, 2003
Date of Patent: Jan 20, 2004
Assignee: Pulse Engineering, Inc. (San Diego, CA)
Inventors: Tung Dang (San Marcos, CA), Glen Alan Cotant (Ramona, CA)
Primary Examiner: Nanda Bondade
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Gazdzinski & Associates
Application Number: 29/177,597
Type: Grant
Filed: Mar 10, 2003
Date of Patent: Jan 20, 2004
Assignee: Pulse Engineering, Inc. (San Diego, CA)
Inventors: Tung Dang (San Marcos, CA), Glen Alan Cotant (Ramona, CA)
Primary Examiner: Nanda Bondade
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Gazdzinski & Associates
Application Number: 29/177,597
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;
International Classification: 1303;