Electronics component assembly

- Pulse Engineering, Inc.
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Description

FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a side elevation view of a second embodiment of an electronics component package, showing our new design;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a front elevation view thereof.

The broken lines depict environmental structure and form no part of the claimed design.

Claims

The ornamental design of an electronics component assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
3638149 January 1972 Bopp et al.
4292614 September 29, 1981 Ono et al.
4507633 March 26, 1985 Minks
4924213 May 8, 1990 Decho et al.
5438307 August 1, 1995 Chou
5801930 September 1, 1998 Dittmann
6549108 April 15, 2003 Fausch
Other references
  • Allied Electronics, 1990, pp. 402 (upper left), 615 (upper right and middle left).
Patent History
Patent number: D485536
Type: Grant
Filed: Mar 10, 2003
Date of Patent: Jan 20, 2004
Assignee: Pulse Engineering, Inc. (San Diego, CA)
Inventors: Tung Dang (San Marcos, CA), Glen Alan Cotant (Ramona, CA)
Primary Examiner: Nanda Bondade
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Gazdzinski & Associates
Application Number: 29/177,597
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;