Packaged semiconductor device

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Description

FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;

FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;

FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;

FIG. 4 is a top view of the packaged semiconductor device;

FIG. 5 is a bottom view of the packaged semiconductor device;

FIG. 6 is an elevational view from the left side of the packaged semiconductor device;

FIG. 7 is an elevational view from the right side of the packaged semiconductor device;

FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,

FIG. 9 is an elevational view from the front side of the packaged semiconductor device.

Claims

We claim the ornamental design for a packaged semiconductor device, as shown and described.

Referenced Cited
U.S. Patent Documents
5434357 July 18, 1995 Belcher et al.
5844307 December 1, 1998 Suzuki et al.
5866942 February 2, 1999 Suzuki et al.
D416236 November 9, 1999 Kobayashi et al.
6238953 May 29, 2001 Tanaka et al.
D466873 December 10, 2002 Kasem et al.
D472528 April 1, 2003 Kasem et al.
6555899 April 29, 2003 Chung et al.
D476962 July 8, 2003 Yoshihira et al.
Patent History
Patent number: D489338
Type: Grant
Filed: Jul 28, 2003
Date of Patent: May 4, 2004
Assignee: Semiconductor Components Industries, L.L.C. (Phoenix, AZ)
Inventors: Michael Seddon (Gilbert, AZ), Francis Carney (Gilbert, AZ), Kent L. Kime (Phoenix, AZ)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: James J. Stipanuk
Application Number: 29/187,122
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;