Packaged semiconductor device
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FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;
FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;
FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;
FIG. 4 is a top view of the packaged semiconductor device;
FIG. 5 is a bottom view of the packaged semiconductor device;
FIG. 6 is an elevational view from the left side of the packaged semiconductor device;
FIG. 7 is an elevational view from the right side of the packaged semiconductor device;
FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,
FIG. 9 is an elevational view from the front side of the packaged semiconductor device.
Claims
We claim the ornamental design for a packaged semiconductor device, as shown and described.
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Type: Grant
Filed: Jul 28, 2003
Date of Patent: May 4, 2004
Assignee: Semiconductor Components Industries, L.L.C. (Phoenix, AZ)
Inventors: Michael Seddon (Gilbert, AZ), Francis Carney (Gilbert, AZ), Kent L. Kime (Phoenix, AZ)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: James J. Stipanuk
Application Number: 29/187,122
International Classification: 1303;