Thermal efficient heat sink for electronic devices
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Description
FIG. 1 is a perspective view of a thermal efficient heat sink for electronic devices, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims
The ornamental design for a thermal efficient heat sink for electronic devices, as shown and described.
Referenced Cited
Patent History
Patent number: D492265
Type: Grant
Filed: May 7, 2003
Date of Patent: Jun 29, 2004
Assignee: Datech Technology Co., Ltd. (Taipei Hsien)
Inventor: Chin-Yueh Chu (Hsin-Chuang)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Troxell Law Office PLLC
Application Number: 29/181,164
Type: Grant
Filed: May 7, 2003
Date of Patent: Jun 29, 2004
Assignee: Datech Technology Co., Ltd. (Taipei Hsien)
Inventor: Chin-Yueh Chu (Hsin-Chuang)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Troxell Law Office PLLC
Application Number: 29/181,164
Classifications