Thermal efficient heat sink for electronic devices

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Description

FIG. 1 is a perspective view of a thermal efficient heat sink for electronic devices, in accordance with the present invention;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a thermal efficient heat sink for electronic devices, as shown and described.

Referenced Cited
U.S. Patent Documents
D453744 February 19, 2002 Lee et al.
6401810 June 11, 2002 Kuo et al.
6598667 July 29, 2003 Kuo
6637502 October 28, 2003 North et al.
6639802 October 28, 2003 Dong et al.
6651734 November 25, 2003 Liu
Patent History
Patent number: D492265
Type: Grant
Filed: May 7, 2003
Date of Patent: Jun 29, 2004
Assignee: Datech Technology Co., Ltd. (Taipei Hsien)
Inventor: Chin-Yueh Chu (Hsin-Chuang)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Troxell Law Office PLLC
Application Number: 29/181,164
Classifications
Current U.S. Class: Heat Sink (D13/179)
International Classification: 1303;