Heat-conducting block of VGA chipset cooling device
Latest Zalman Tech Co., Ltd. Patents:
- Pressure control system for liquid-cooled electronic component cooling device
- Water pump for water cooler for electronic component
- Notebook computer cooler using thermoelectric element
- NOTEBOOK COMPUTER COOLER USING THERMOELECTRIC ELEMENT
- METHOD OF FABRICATING ELECTRONIC COMPONENT COOLING APPARATUS INCLUDING HEAT PIPES AND HEAT TRANSFER BLOCK
FIG. 1 is a perspective view of a heat-conducting block of VGA chipset cooling device according to the present invention.
FIG. 2 is a front view of the heat-conducting block according to the present invention; the rear view of the heat-conducting block is a mirror image of FIG. 2.
FIG. 3 is a right side view of the heat-conducting block according to the present invention; the left side view of the heat-conducting block is a mirror image of FIG. 3.
FIG. 4 is a top plan view of the heat-conducting block according to the present invention.
FIG. 5 is a bottom plan view of the heat-conducting block according to the present invention; and,
FIG. 6 is a perspective view illustrating use of the heat-conducting block according to the present invention.
The broken lines in the figures indicate environmental elements for illustrative purposes only and form no part of the claimed design.
Claims
I claim the ornamental design for a heat-conducting block of VGA chipset cooling device, as shown and described in the attached six drawings.
Type: Grant
Filed: Apr 15, 2003
Date of Patent: Jul 20, 2004
Assignee: Zalman Tech Co., Ltd. (Gumchun-gu)
Inventor: Sang-cheol Lee (Kunpo-si)
Primary Examiner: Brian N Vinson
Attorney, Agent or Law Firm: St. Onge Steward Johnston & Reens LLC
Application Number: 29/179,828
