Computer mainframe front panel

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Description

FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof.

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a top, front and left side perspective view thereof, shown with the fronts in an open position; and,

FIG. 9 is a top, front and right side perspective view thereof, shown with the fronts in an open position.

Claims

The ornamental design for a computer mainframe front panel, as shown and described.

Referenced Cited
U.S. Patent Documents
D425044 May 16, 2000 Jean et al.
D459357 June 25, 2002 Lo
D476992 July 8, 2003 Chien et al.
Patent History
Patent number: D505426
Type: Grant
Filed: May 28, 2004
Date of Patent: May 24, 2005
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Pei-Shi Lin (Taipei Hsien)
Primary Examiner: Freda S. Nunn
Attorney: Rosenberg, Klein & Lee
Application Number: 29/206,267
Classifications
Current U.S. Class: Door Or Panel (D14/441)