Thermal module
Latest ASUSTek Computer Inc. Patents:
- Method and apparatus for quality of service (QOS) information modification in a wireless communication system
- Heat transfer device
- Heat dissipation module and electronic device having the same
- Hinge structure
- All-in-one computer having displays with touch control and display control method based on touch control
Description
FIG. 1 is a perspective view of a thermal module showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
Claims
The ornamental design for a thermal module, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
6137681 | October 24, 2000 | Lu |
6412546 | July 2, 2002 | Lin et al. |
6480387 | November 12, 2002 | Lee et al. |
6560113 | May 6, 2003 | Ma |
20030081382 | May 1, 2003 | Lin |
20030117773 | June 26, 2003 | Cheng et al. |
514485 | December 2002 | TW |
Patent History
Patent number: D510324
Type: Grant
Filed: Dec 31, 2003
Date of Patent: Oct 4, 2005
Assignee: ASUSTek Computer Inc. (Taipei)
Inventors: Chi-Chang Lin (Lujhou), Chih-Yuan Cheng (Banciao), Heng-Tsung Wang (Taipei)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rabin & Berdo, P.C.
Application Number: 29/196,439
Type: Grant
Filed: Dec 31, 2003
Date of Patent: Oct 4, 2005
Assignee: ASUSTek Computer Inc. (Taipei)
Inventors: Chi-Chang Lin (Lujhou), Chih-Yuan Cheng (Banciao), Heng-Tsung Wang (Taipei)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rabin & Berdo, P.C.
Application Number: 29/196,439
Classifications
Current U.S. Class:
Heat Sink (D13/179)