Thermal module

- ASUSTek Computer Inc.
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Description

FIG. 1 is a perspective view of a thermal module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear elevational view thereof.

Claims

The ornamental design for a thermal module, as shown and described.

Referenced Cited
U.S. Patent Documents
6137681 October 24, 2000 Lu
6412546 July 2, 2002 Lin et al.
6480387 November 12, 2002 Lee et al.
6560113 May 6, 2003 Ma
20030081382 May 1, 2003 Lin
20030117773 June 26, 2003 Cheng et al.
Foreign Patent Documents
514485 December 2002 TW
Patent History
Patent number: D510324
Type: Grant
Filed: Dec 31, 2003
Date of Patent: Oct 4, 2005
Assignee: ASUSTek Computer Inc. (Taipei)
Inventors: Chi-Chang Lin (Lujhou), Chih-Yuan Cheng (Banciao), Heng-Tsung Wang (Taipei)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rabin & Berdo, P.C.
Application Number: 29/196,439
Classifications
Current U.S. Class: Heat Sink (D13/179)