Ink pad assembly

- Yi Yao Co., Ltd.
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Description

FIG. 1 is a top perspective view of an ink pad assembly showing my new design;

FIG. 2 is a top plan view thereof drawn on a slightly reduced scale;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a side elevation thereof; and,

FIG. 5 is another top perspective view thereof shown in a open condition.

Claims

The ornamental design for an ink pad assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
D115959 August 1939 Gaige
D223056 March 1972 Majewski
D228157 August 1973 Sussman
4375191 March 1, 1983 Dickey
5505130 April 9, 1996 Winston
D372341 July 30, 1996 Arntsen
D381038 July 15, 1997 Yasoshima
D389509 January 20, 1998 Yasoshima
D427624 July 4, 2000 Yasohima
D482497 November 18, 2003 Mansau et al.
Patent History
Patent number: D515620
Type: Grant
Filed: Mar 28, 2005
Date of Patent: Feb 21, 2006
Assignee: Yi Yao Co., Ltd. (Keelung)
Inventor: Yun Dien Lien (Keelung)
Primary Examiner: Charles A. Rademaker
Attorney: Bacon & Thomas PLLC
Application Number: 29/226,239
Classifications
Current U.S. Class: Stamp Pad (D18/17)