Headset
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Description
FIG. 1 is a perspective view of an ornamental design of a second embodiment of a headset.
FIG. 2 is a front view of the second embodiment.
FIG. 3 is a back view of the second embodiment.
FIG. 4 is a top view of the second embodiment.
FIG. 5 is a left side view of the second embodiment.
FIG. 6 is a right side view of the second embodiment; and,
FIG. 7 is a bottom view of the second embodiment.
The broken lines shown in FIGS. 1-7 are included for the purposes of illustrating environmental elements only and form no part of the claimed design.
Claims
The ornamental design for a headset, as shown and described.
Referenced Cited
Patent History
Patent number: D521987
Type: Grant
Filed: Feb 17, 2004
Date of Patent: May 30, 2006
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventors: Jeong J. Ma (Buffalo Grove, IL), Donald Y. Tio (Singapore), Hung Shen Pan (Sindian)
Primary Examiner: Paula A. Greene
Attorney: Lawrence J. Chapa
Application Number: 29/199,536
Type: Grant
Filed: Feb 17, 2004
Date of Patent: May 30, 2006
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventors: Jeong J. Ma (Buffalo Grove, IL), Donald Y. Tio (Singapore), Hung Shen Pan (Sindian)
Primary Examiner: Paula A. Greene
Attorney: Lawrence J. Chapa
Application Number: 29/199,536
Classifications
Current U.S. Class:
Headphone (D14/223)
