Wire mount connector
Latest 3M Innovative Properties Company Patents:
Description
FIG. 1 is a front elevation view of a wire mount connector showing our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a cross sectional view taken along line 6—6 in FIG. 1.
The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a wire mount connector, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
5533901 | July 9, 1996 | Hunt et al. |
D416539 | November 16, 1999 | Narumo et al. |
D435245 | December 19, 2000 | Hwang |
D455124 | April 2, 2002 | Miya et al. |
6500023 | December 31, 2002 | Duong et al. |
D486451 | February 10, 2004 | Moritake |
6783387 | August 31, 2004 | Lin et al. |
D500987 | January 18, 2005 | Shimizu et al. |
D505115 | May 17, 2005 | Shimizu et al. |
- Miniature Receptacle & Plug (MRP)System “Product Specification”, Sumitomo 3M, Japan/Minnesota Mining and Manufacturing Company, St. Paul, Minnesota, USA [on line], [available on the Internet on Oct. 22, 2003], [retrieved from the Internet on Oct. 22, 2003], <http://www.mmm.co.jp/electrical/connector/list_b.html>.
Patent History
Patent number: D526618
Type: Grant
Filed: Sep 2, 2003
Date of Patent: Aug 15, 2006
Assignee: 3M Innovative Properties Company (St. Paul, MN)
Inventors: Tatsuyoshi Shimizu (Kawasaki), Hiroyuki Matsuoka (Yokohama)
Primary Examiner: Stella Reid
Assistant Examiner: Daniel Bui
Attorney: Yen Tong Florczak
Application Number: 29/189,313
Type: Grant
Filed: Sep 2, 2003
Date of Patent: Aug 15, 2006
Assignee: 3M Innovative Properties Company (St. Paul, MN)
Inventors: Tatsuyoshi Shimizu (Kawasaki), Hiroyuki Matsuoka (Yokohama)
Primary Examiner: Stella Reid
Assistant Examiner: Daniel Bui
Attorney: Yen Tong Florczak
Application Number: 29/189,313
Classifications