Computer motherboard packaging box

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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a perspective view of a computer motherboard packaging box of our new design;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a side elevational view thereof from the side opposite that shown in FIG. 2 ;

FIG. 4 is an end elevational view thereof;

FIG. 5 is an end elevational view thereof from the end opposite that shown in FIG. 4;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a computer motherboard packaging box, as shown and described.

Referenced Cited
U.S. Patent Documents
5788065 August 4, 1998 Focke
D489002 April 27, 2004 Meyer et al.
D496859 October 5, 2004 Hamuro et al.
D510702 October 18, 2005 Kusumi et al.
D516906 March 14, 2006 Ogawa
Patent History
Patent number: D535190
Type: Grant
Filed: Nov 15, 2004
Date of Patent: Jan 16, 2007
Assignee: Hon Hai Precision Ind. Co., Ltd. (Taipei Hsien)
Inventors: Jing-Qun Chen (Shenzhen), Chun-Chi Liang (Shenzhen), Yun-Dong Xu (Shenzhen)
Primary Examiner: Sandra L. Morris
Attorney: Wei Te Chung
Application Number: 29/217,289
Classifications
Current U.S. Class: D9/652; D9/432