Combined stamp pad and lid

- Tsukineko Co., Ltd.
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Description

FIG. 1 is a top perspective view of a combined stamp pad and lid showing my new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a rear perspective view thereof;

FIG. 4 is a side elevation thereof;

FIG. 5 is a front perspective view thereof;

FIG. 6 is a top perspective view of the design shown in FIGS. 1 through 5 with the lid removed;

FIG. 7 is a side elevation thereof;

FIG. 8 is a front perspective thereof;

FIG. 9 is a rear perspective view thereof;

FIG. 10 is a top plan view of the lid member of the design shown in FIGS. 1 through 5;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a side elevation thereof;

FIG. 13 is a rear elevation thereof; and,

FIG. 14 is a front elevation thereof shown in an inverted condition.

Claims

The ornamental design for a combined stamp pad and lid, as shown and described.

Referenced Cited
U.S. Patent Documents
D233174 October 1974 Funahashi
D318685 July 30, 1991 Kida
D339819 September 28, 1993 Chen
D353392 December 13, 1994 Winston
D419178 January 18, 2000 Kim et al.
D427624 July 4, 2000 Yasohima
D447166 August 28, 2001 Yasoshima
D459386 June 25, 2002 Pichler
7077063 July 18, 2006 Petersen
Patent History
Patent number: D553181
Type: Grant
Filed: Feb 3, 2006
Date of Patent: Oct 16, 2007
Assignee: Tsukineko Co., Ltd. (Tokyo)
Inventor: Ryo Yasoshima (Tokyo)
Primary Examiner: Charles A. Rademaker
Attorney: Seed IP Law Group PLLC
Application Number: 29/253,346
Classifications
Current U.S. Class: Stamp Pad (D18/17)