Module assembly
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Description
The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a module assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
D303246 | September 5, 1989 | Freeman et al. |
D392645 | March 24, 1998 | Wakabayashi |
D421964 | March 28, 2000 | Nagasawa et al. |
D432991 | October 31, 2000 | Taguchi |
6299480 | October 9, 2001 | Xu et al. |
D503384 | March 29, 2005 | Weatherley |
D526616 | August 15, 2006 | Nakashima et al. |
20050277339 | December 15, 2005 | Caveney et al. |
Patent History
Patent number: D553572
Type: Grant
Filed: Oct 14, 2004
Date of Patent: Oct 23, 2007
Assignee: Cisco Technology, Inc. (San Jose, CA)
Inventors: George Youhzi Yi (Fremont, CA), William J. Lewis (Mountain View, CA), Hsi-sheng Chen (Panchiao), Hung-Ting Lin (Taipei), Kuang Hsin Hsu (Tu-cheng Industrial Area)
Primary Examiner: Daniel Bui
Attorney: Trellis Intellectual Property Law Group, PC
Application Number: 29/215,156
Type: Grant
Filed: Oct 14, 2004
Date of Patent: Oct 23, 2007
Assignee: Cisco Technology, Inc. (San Jose, CA)
Inventors: George Youhzi Yi (Fremont, CA), William J. Lewis (Mountain View, CA), Hsi-sheng Chen (Panchiao), Hung-Ting Lin (Taipei), Kuang Hsin Hsu (Tu-cheng Industrial Area)
Primary Examiner: Daniel Bui
Attorney: Trellis Intellectual Property Law Group, PC
Application Number: 29/215,156
Classifications