Package for light emitting diode

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Description

FIG. 1 is a perspective view of a package for light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view, the right elevational view being a mirror image thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for package for light emitting diode, as shown and described.

Referenced Cited
U.S. Patent Documents
D476960 July 8, 2003 Fukasawa et al.
D491538 June 15, 2004 Ishida
D495668 September 7, 2004 Kim et al.
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D530684 October 24, 2006 Tzeng
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D533146 December 5, 2006 Wu et al.
D534132 December 26, 2006 Yoon
D541759 May 1, 2007 Shin et al.
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D548704 August 14, 2007 Wu et al.
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Foreign Patent Documents
D1171213 February 2003 JP
30-0147175 June 2006 KR
00555458 September 2003 TW
Patent History
Patent number: D565514
Type: Grant
Filed: Jul 5, 2006
Date of Patent: Apr 1, 2008
Assignee: Seoul Semiconductor Co. Ltd. (Seoul)
Inventor: Jae Ho Cho (Seoul)
Primary Examiner: Selina Sikder
Attorney: Townsend and Townsend and Crew LLP
Application Number: 29/262,576
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)