Housing for a headset
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Description
The broken lines included for illustration purposes form no part of the claimed design.
Claims
The ornamental housing for a headset, as shown and described.
Referenced Cited
U.S. Patent Documents
1852130 | April 1932 | Schier |
D287765 | January 13, 1987 | Topholm |
D321881 | November 26, 1991 | Hopewell |
D352036 | November 1, 1994 | Sekita |
5812680 | September 22, 1998 | Glendon |
D411200 | June 22, 1999 | Almqvist |
D485549 | January 20, 2004 | Ma et al. |
D500179 | December 21, 2004 | Coutant et al. |
D502695 | March 8, 2005 | Suzuki |
D511768 | November 22, 2005 | Naito et al. |
D512417 | December 6, 2005 | Hirakawa et al. |
D519985 | May 2, 2006 | Wikel et al. |
Patent History
Patent number: D568290
Type: Grant
Filed: Mar 21, 2006
Date of Patent: May 6, 2008
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventor: Harold L. Wikel (Muskego, WI)
Primary Examiner: Paula A. Greene
Attorney: Randall S. Vaas
Application Number: 29/256,518
Type: Grant
Filed: Mar 21, 2006
Date of Patent: May 6, 2008
Assignee: Motorola, Inc. (Schaumburg, IL)
Inventor: Harold L. Wikel (Muskego, WI)
Primary Examiner: Paula A. Greene
Attorney: Randall S. Vaas
Application Number: 29/256,518
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)