Linear module

- Hiwin Mikrosystem Corp.
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Description

FIG. 1 is a perspective view of a linear module showing our new design thereof;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a linear module, as shown and described.

Referenced Cited
U.S. Patent Documents
4439698 March 27, 1984 Chen
D303393 September 12, 1989 Stoll
D370683 June 11, 1996 Stahlman et al.
D379468 May 27, 1997 Nagai et al.
D407409 March 30, 1999 Masuda et al.
D413129 August 24, 1999 Nagai et al.
D428617 July 25, 2000 Hariwara
6344718 February 5, 2002 Nagai et al.
D487902 March 30, 2004 Nielsen et al.
D490446 May 25, 2004 Miyazaki et al.
Patent History
Patent number: D576646
Type: Grant
Filed: May 14, 2007
Date of Patent: Sep 9, 2008
Assignee: Hiwin Mikrosystem Corp. (Taichung)
Inventors: Li-Fen Liao (Taichung), Chien-Cheng Lin (Taichung)
Primary Examiner: Sandra Snapp
Assistant Examiner: Patricia Palasik
Attorney: Charles E. Baxley
Application Number: 29/286,636
Classifications