Bonding device clamp

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Description

FIG. 1 is a front perspective view of the bonding device clamp of the present invention;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a side elevation view thereof;

FIG. 4 is a back elevation view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

The broken line showing of parts of the drawings is included for the purpose of illustrating use and environment and forms no part of the claimed design.

Claims

The ornamental design for a bonding device clamp, as shown and described.

Referenced Cited
U.S. Patent Documents
D271375 November 15, 1983 Baroody
4784621 November 15, 1988 Auclair
5006074 April 9, 1991 Franks, Jr.
D320915 October 22, 1991 Sanguino
5114354 May 19, 1992 Franks, Jr.
5160271 November 3, 1992 Franks, Jr.
D408362 April 20, 1999 Coll
5928006 July 27, 1999 Franks, Jr.
6329592 December 11, 2001 Auclair
6701976 March 9, 2004 Toraishi
6796003 September 28, 2004 Marvel
7044754 May 16, 2006 Malin
D549567 August 28, 2007 Hamu
Patent History
Patent number: D577977
Type: Grant
Filed: Jul 26, 2007
Date of Patent: Oct 7, 2008
Assignee: Thomas & Betts International, Inc. (Wilmington, DE)
Inventor: Luis J. Hernandez (Memphis, TN)
Primary Examiner: Louis S Zarfas
Assistant Examiner: David G Muller
Attorney: G. Andrew Barger
Application Number: 29/289,632
Classifications
Current U.S. Class: D8/72; D8/387