Clamping apparatus

- SMC Corporation
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Description

FIG. 1 is a top and left front perspective view of a clamping apparatus, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a clamping apparatus, as shown.

Referenced Cited
U.S. Patent Documents
390863 October 1888 Kelly
4151792 May 1, 1979 Nearhood
D261353 October 20, 1981 Ambler et al.
D261392 October 20, 1981 Miyakawa
D324992 March 31, 1992 Ono et al.
D364546 November 28, 1995 Tieffel et al.
D389888 January 27, 1998 Weissenborn
D431040 September 19, 2000 Makabe et al.
D435415 December 26, 2000 Johnson et al.
D438441 March 6, 2001 Nagai et al.
D440138 April 10, 2001 Campbell
6382078 May 7, 2002 Numata
D480938 October 21, 2003 Whitley
Patent History
Patent number: D587087
Type: Grant
Filed: Sep 28, 2007
Date of Patent: Feb 24, 2009
Assignee: SMC Corporation (Tokyo)
Inventors: Kenichi Takeda (Tsukubamirai), Tsuyoshi Asaba (Tsukubamirai)
Primary Examiner: Louis S Zarfas
Assistant Examiner: David G Muller
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/295,487
Classifications
Current U.S. Class: D8/72