Heat dissipating module
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Description
Claims
The ornamental design for a heat dissipating module, as shown and described herein.
Referenced Cited
U.S. Patent Documents
D266082 | September 7, 1982 | Asanuma |
6446708 | September 10, 2002 | Lai |
D467559 | December 24, 2002 | Lee |
6607028 | August 19, 2003 | Wang et al. |
20060219392 | October 5, 2006 | Lin |
20060225866 | October 12, 2006 | Chen |
Patent History
Patent number: D597497
Type: Grant
Filed: Nov 15, 2007
Date of Patent: Aug 4, 2009
Assignee: Delta Electronics Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yu-Hung Huang (Taoyuan Hsien), Chun-Yang Hung (Taoyuan Hsien), Sung-Ching Ho (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/290,286
Type: Grant
Filed: Nov 15, 2007
Date of Patent: Aug 4, 2009
Assignee: Delta Electronics Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yu-Hung Huang (Taoyuan Hsien), Chun-Yang Hung (Taoyuan Hsien), Sung-Ching Ho (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/290,286
Classifications
Current U.S. Class:
Heat Sink (D13/179)