Heat dissipating module

- Delta Electronics Inc.
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Description

FIG. 1 is a perspective view of a heat dissipating module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear eleavational view thereof;

FIG. 4 is a left side elevational view thereof; and

FIG. 5 is a right side elevational view thereof.

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipating module, as shown and described herein.

Referenced Cited
U.S. Patent Documents
D266082 September 7, 1982 Asanuma
6446708 September 10, 2002 Lai
D467559 December 24, 2002 Lee
6607028 August 19, 2003 Wang et al.
20060219392 October 5, 2006 Lin
20060225866 October 12, 2006 Chen
Patent History
Patent number: D597497
Type: Grant
Filed: Nov 15, 2007
Date of Patent: Aug 4, 2009
Assignee: Delta Electronics Inc. (Taoyuan Hsien)
Inventors: Chin-Ming Chen (Taoyuan Hsien), Yu-Hung Huang (Taoyuan Hsien), Chun-Yang Hung (Taoyuan Hsien), Sung-Ching Ho (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Birch, Stewart, Kolasch & Birch, LLP
Application Number: 29/290,286
Classifications
Current U.S. Class: Heat Sink (D13/179)