Connector for flexible printed circuit board

- Omron Corporation
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Description

FIG. 1 is a top, front and right side perspective view of a connector for flexible printed circuit board showing a first embodiment of my new design;

FIG. 2 is a top, rear and left side perspective view thereof;

FIG. 3 is a bottom, rear and right side perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a right side view thereof;

FIG. 8 is a top plan view thereof.

FIG. 9 is a bottom plan view thereof;

FIG. 10 is a perspective cross-sectional view taken along the line of X—X of FIG. 8;

FIG. 11 is a cross-sectional perspective view taken along the line of XI—XI of FIG. 8;

FIG. 12 is a top, front and right side perspective view thereof, shown in an alternate position of use;

FIG. 13 is a top, rear and left side perspective view thereof;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a top, front and right side perspective view of a connector for flexible printed circuit board showing a second embodiment of my new design;

FIG. 17 is a top, rear and left side perspective view thereof.

FIG. 18 is a bottom, rear and right side perspective view thereof;

FIG. 19 is a front elevational view thereof;

FIG. 20 is a rear elevational view thereof

FIG. 21 is a left side view thereof;

FIG. 22 is a right side view thereof;

FIG. 23 is a top plan view thereof;

FIG. 24 is a bottom plan view thereof;

FIG. 25 is a perspective cross-sectional view taken along the line of XXV of FIG. 23

FIG. 26 is a perspective cross-sectional view taken along the line of XXVI of FIG. 23.

FIG. 27 is a top, front and right side perspective view thereof, shown in an alternate position;

FIG. 28 is a top, rear and left side perspective view prospective thereof;

FIG. 29 is a front elevational view thereof; and,

FIG. 30 is a top plan view thereof.

Claims

The ornamental design for a connector for flexible printed circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
D470110 February 11, 2003 Yamane
D472219 March 25, 2003 Miura
D482327 November 18, 2003 Saito et al.
D500985 January 18, 2005 Yamane et al.
D501183 January 25, 2005 Yamane et al.
D517494 March 21, 2006 Ikenaga et al.
D582853 December 16, 2008 Peng et al.
D589885 April 7, 2009 Wu
20060105622 May 18, 2006 Nakano et al.
Foreign Patent Documents
D1180010 July 2003 JP
D1180302 July 2003 JP
D1233430 March 2005 JP
D1250913 September 2005 JP
D1251412 September 2005 JP
Patent History
Patent number: D600209
Type: Grant
Filed: Aug 27, 2008
Date of Patent: Sep 15, 2009
Assignee: Omron Corporation (Kyoto-shi)
Inventor: Masato Matoba (Kyoto)
Primary Examiner: Daniel D Bui
Attorney: Harness, Dickey & Pierce, P.L.C.
Application Number: 29/323,525