Pedestal of heat insulating cylinder for manufacturing semiconductor wafers

- Tokyo Electron Limited
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Description

FIG. 1 is a front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 88 of FIG. 2; and,

FIG. 9 is a cross-section view taken through line 99 of FIG. 2.

Claims

The ornamental design for a pedestal of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Referenced Cited
U.S. Patent Documents
D404016 January 12, 1999 Ishii
D409158 May 4, 1999 Shimazu
D424527 May 9, 2000 Ishii
6099302 August 8, 2000 Hong et al.
6110285 August 29, 2000 Kitazawa et al.
6716027 April 6, 2004 Kim et al.
Patent History
Patent number: D615936
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 18, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,847