Earphone assembly
Latest Cheng Uei Precision Industry Co., Ltd. Patents:
Description
Claims
The ornamental design for an earphone assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
3343772 | September 1967 | Howell et al. |
D459342 | June 25, 2002 | Marion et al. |
D554109 | October 30, 2007 | Ledbetter et al. |
D576608 | September 9, 2008 | Yu |
D591264 | April 28, 2009 | Hong et al. |
D599781 | September 8, 2009 | Lee et al. |
D599785 | September 8, 2009 | Matsuda et al. |
D600236 | September 15, 2009 | Sanguinetti et al. |
D607880 | January 12, 2010 | Chung et al. |
Patent History
Patent number: D625704
Type: Grant
Filed: Oct 23, 2009
Date of Patent: Oct 19, 2010
Assignee: Cheng Uei Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Jung-Ching Cheng (Tu-Cheng)
Primary Examiner: Paula Greene
Attorney: Cheng-Ju Chiang
Application Number: 29/345,998
Type: Grant
Filed: Oct 23, 2009
Date of Patent: Oct 19, 2010
Assignee: Cheng Uei Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Jung-Ching Cheng (Tu-Cheng)
Primary Examiner: Paula Greene
Attorney: Cheng-Ju Chiang
Application Number: 29/345,998
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)