Earphone assembly

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Description

FIG. 1 is a perspective view of an earphone assembly showing my new design, the cord is drawn broken away to show indeterminate length;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another perspective view of the earphone assembly showing my new design.

Claims

The ornamental design for an earphone assembly, as shown and described.

Referenced Cited
U.S. Patent Documents
3343772 September 1967 Howell et al.
D459342 June 25, 2002 Marion et al.
D554109 October 30, 2007 Ledbetter et al.
D576608 September 9, 2008 Yu
D591264 April 28, 2009 Hong et al.
D599781 September 8, 2009 Lee et al.
D599785 September 8, 2009 Matsuda et al.
D600236 September 15, 2009 Sanguinetti et al.
D607880 January 12, 2010 Chung et al.
Patent History
Patent number: D625704
Type: Grant
Filed: Oct 23, 2009
Date of Patent: Oct 19, 2010
Assignee: Cheng Uei Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventor: Jung-Ching Cheng (Tu-Cheng)
Primary Examiner: Paula Greene
Attorney: Cheng-Ju Chiang
Application Number: 29/345,998
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)