Stamp mount cover

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Description

FIG. 1 is a top perspective view of the stamp mount cover in accordance with my design.

FIG. 2 is a bottom perspective view thereof.

FIG. 3 is a top elevation view thereof.

FIG. 4 is a right side elevation view thereof.

FIG. 5 is a left side elevation view thereof.

FIG. 6 is a front elevation view thereof.

FIG. 7 is a rear elevation view thereof; and,

FIG. 8 is a bottom elevation view thereof.

Claims

The ornamental design for a stamp mount cover, as shown and described.

Referenced Cited
U.S. Patent Documents
765110 July 1904 Test
3646907 March 1972 Dudley
4267772 May 19, 1981 Maitland
D389175 January 13, 1998 Imamaki
5974969 November 2, 1999 Okumura et al.
D427234 June 27, 2000 Loy et al.
D502498 March 1, 2005 Kida et al.
7066089 June 27, 2006 Shih
7506582 March 24, 2009 Petersen
7686440 March 30, 2010 Silverbrook et al.
Patent History
Patent number: D626586
Type: Grant
Filed: Aug 28, 2009
Date of Patent: Nov 2, 2010
Assignee: Sun Same Enterprises Co., Ltd. (Yongkang, Tainan Hsien)
Inventor: Hsu-Shen Shih (Tainan)
Primary Examiner: Charles A Rademaker
Attorney: Su IP Consulting
Application Number: 29/342,687
Classifications
Current U.S. Class: Element Or Attachment (D18/18)