Semiconductor manufacturing equipment

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a front, top and right side perspective view of an semiconductor manufacturing equipment showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a right side elevational view thereof.

The broken line showing of the “semiconductor manufacturing equipment” is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

We claim the ornamental design for a semiconductor manufacturing equipment, as shown and described.

Referenced Cited
U.S. Patent Documents
5810538 September 22, 1998 Ozawa et al.
D469412 January 28, 2003 Witte
6547660 April 15, 2003 Suenaga et al.
6580087 June 17, 2003 Suzuki et al.
6945746 September 20, 2005 Yamagishi et al.
7039499 May 2, 2006 Nasr et al.
7607879 October 27, 2009 Hall et al.
D607424 January 5, 2010 Hosaka et al.
20060120833 June 8, 2006 Bonora et al.
20070098527 May 3, 2007 Hall et al.
20080166208 July 10, 2008 Lester et al.
20080317581 December 25, 2008 Makino et al.
20110123300 May 26, 2011 Hashimoto
20110236159 September 29, 2011 Lenz
Patent History
Patent number: D652395
Type: Grant
Filed: Nov 29, 2010
Date of Patent: Jan 17, 2012
Assignee: Hitachi Kokusai Electric Inc. (Tokyo)
Inventors: Masakazu Shimada (Toyama), Takashi Nogami (Toyama), Satoshi Aizawa (Toyama), Seiyo Nakashima (Toyama), Tomoyuki Yamada (Toyama), Shinobu Sugiura (Toyama), Yukinori Aburatani (Toyama), Mitsuhiro Nagata (Kodaira)
Primary Examiner: Selina Sikder
Attorney: Stites & Harbison PLLC
Application Number: 29/371,213