Package

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Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a package of the present invention.

FIG. 2 is a rear view of the package of FIG. 1, also showing instructions for use.

FIG. 3 is a top plan view of the package of FIG. 1.

FIG. 4 is a bottom view of the package of FIG. 1.

FIG. 5 is a right side view of the package of FIG. 1.

FIG. 6 is a left side view of the package of FIG. 1.

FIG. 7 is a perspective view of the package of FIG. 1.

FIG. 8 is a front view of another package of the present invention.

FIG. 9 is a rear view of the package of FIG. 8, also showing instructions for use.

FIG. 10 is a top plan view of the package of FIG. 8.

FIG. 11 is a bottom view of the package of FIG. 8.

FIG. 12 is a right side view of the package of FIG. 8.

FIG. 13 is a left side view of the package of FIG. 8.

FIG. 14 is a perspective view of the package of FIG. 8.

FIG. 15 is a front view of another package of the present invention.

FIG. 16 is a rear view of the package of FIG. 15.

FIG. 17 is a top plan view of the package of FIG. 15.

FIG. 18 is a bottom view of the package of FIG. 15.

FIG. 19 is a right side view of the package of FIG. 15.

FIG. 20 is a left side view of the package of FIG. 15.

FIG. 21 is a perspective view of the package of FIG. 15.

FIG. 22 is a front view of another package of the present invention.

FIG. 23 is a rear view of the package of FIG. 22.

FIG. 24 is a top plan view of the package of FIG. 22.

FIG. 25 is a bottom view of the package of FIG. 22.

FIG. 26 is a right side view of the package of FIG. 22.

FIG. 27 is a left side view of the package of FIG. 22; and,

FIG. 28 is a perspective view of the package of FIG. 22.

The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims

The ornamental design for a package, as shown and described.

Referenced Cited
U.S. Patent Documents
D453682 February 19, 2002 Kusumi et al.
D453683 February 19, 2002 Kusumi et al.
D591163 April 28, 2009 Kusumi
D597412 August 4, 2009 Kusumi
D603271 November 3, 2009 Kusumi et al.
D603272 November 3, 2009 Kusumi
D603718 November 10, 2009 Kusumi et al.
D621700 August 17, 2010 Kusumi et al.
D621701 August 17, 2010 Kusumi et al.
Foreign Patent Documents
1277438 July 2006 JP
115669 March 2007 TW
118333 August 2007 TW
Patent History
Patent number: D655191
Type: Grant
Filed: Jan 14, 2011
Date of Patent: Mar 6, 2012
Assignee: Hisamitsu Pharmaceutical Co. Inc. (Tosu-shi, Saga)
Inventors: Sayaka Mochizuki (Tokyo), Yuichi Toyofuku (Tokyo), Tomoko Handa (Tokyo)
Primary Examiner: Sandra Morris
Attorney: Leydig, Voit & Mayer
Application Number: 29/383,267
Classifications
Current U.S. Class: D9/624