Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

I claim the ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D578084 October 7, 2008 Kobayakawa
D578969 October 21, 2008 Kobayakawa
D628541 December 7, 2010 Lin
D632267 February 8, 2011 Chen et al.
D635529 April 5, 2011 Hsu
D640994 July 5, 2011 Lin et al.
D640995 July 5, 2011 Lin et al.
D640996 July 5, 2011 Lee et al.
20070063213 March 22, 2007 Hsieh et al.
Patent History
Patent number: D656107
Type: Grant
Filed: Jun 29, 2011
Date of Patent: Mar 20, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventor: Chin-Chang Hsu (Pingtung)
Primary Examiner: Selina Sikder
Attorney: Schmeiser Olsen & Watts LLP
Application Number: 29/396,427
Classifications