Cover of an electronic device having surface ornamentation
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The present application is related to co-pending U.S. patent application Ser. No. 29/419,160, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. This application has the same assignee as the present application and has been concurrently filed herewith. The above-identified application is incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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Type: Grant
Filed: Apr 25, 2012
Date of Patent: Sep 4, 2012
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Carla Jobe Wright
Attorney: Altis Law Group, Inc.
Application Number: 29/419,162