Light emitting diode package

- Lextar Electronics, Corp
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is the other perspective view thereof; and,

FIG. 9 is another perspective view thereof.

Claims

I claim the ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
7393122 July 1, 2008 Tsuzuki et al.
D609654 February 9, 2010 Hsieh
D610558 February 23, 2010 Hsieh
D615935 May 18, 2010 An et al.
D622231 August 24, 2010 Sung
D630596 January 11, 2011 An
Patent History
Patent number: D670662
Type: Grant
Filed: Nov 21, 2011
Date of Patent: Nov 13, 2012
Assignee: Lextar Electronics, Corp (Hsinchu)
Inventor: Te-Hao Sun (Kaohsiung)
Primary Examiner: Selina Sikder
Attorney: Schmeiser Olsen & Watts LLP
Application Number: 29/406,916
Classifications