Cooling jacket for semiconductor device
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Description
Claims
The ornamental design for a cooling jacket for semiconductor device, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- Takahisa Hitachi, Hiromichi Gohara, and Fumio Nagaune; Direct Liquid Cooling IGBT Module for Automotive Applications; vol. 84 No. 5 2011; Issued on May 17, 2011.
- Fumio Nagaune, Hiromichi Gohara, Shinichiro Adachi, Takahisa Hitachi, Hiroki Shibata, Akira Morozumi and Akira Nishiura; Small Size and High Thermal Conductivity IGBT Module for Auto-motive Applications; PCIM Europe 2011, May 17-19, 2011, Nuremberg, Germany; Issued on Nov. 10, 2011.
Patent History
Patent number: D684544
Type: Grant
Filed: Nov 14, 2011
Date of Patent: Jun 18, 2013
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventor: Fumio Nagaune (Kanagawa)
Primary Examiner: Selina Sikder
Application Number: 29/406,390
Type: Grant
Filed: Nov 14, 2011
Date of Patent: Jun 18, 2013
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventor: Fumio Nagaune (Kanagawa)
Primary Examiner: Selina Sikder
Application Number: 29/406,390
Classifications
Current U.S. Class:
Heat Sink (D13/179)