Cooling jacket for semiconductor device

- Fuji Electric Co., Ltd.
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Description

FIG. 1 is a perspective view of front, top plan and right side of a cooling jacket for semiconductor device showing my new design;

FIG. 2 is a perspective view of rear, bottom and left side thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof;

FIG. 8 is a right side view thereof; and,

FIG. 9 is a cross-sectional view thereof taken along line 9-9 in FIG. 9 view.

Claims

The ornamental design for a cooling jacket for semiconductor device, as shown and described.

Referenced Cited
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Foreign Patent Documents
2001-024126 January 2001 JP
2001-308246 November 2001 JP
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Other references
  • Takahisa Hitachi, Hiromichi Gohara, and Fumio Nagaune; Direct Liquid Cooling IGBT Module for Automotive Applications; vol. 84 No. 5 2011; Issued on May 17, 2011.
  • Fumio Nagaune, Hiromichi Gohara, Shinichiro Adachi, Takahisa Hitachi, Hiroki Shibata, Akira Morozumi and Akira Nishiura; Small Size and High Thermal Conductivity IGBT Module for Auto-motive Applications; PCIM Europe 2011, May 17-19, 2011, Nuremberg, Germany; Issued on Nov. 10, 2011.
Patent History
Patent number: D684544
Type: Grant
Filed: Nov 14, 2011
Date of Patent: Jun 18, 2013
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventor: Fumio Nagaune (Kanagawa)
Primary Examiner: Selina Sikder
Application Number: 29/406,390
Classifications
Current U.S. Class: Heat Sink (D13/179)