LED chip
Latest Cree, Inc. Patents:
- Die-attach method to compensate for thermal expansion
- Group III HEMT and capacitor that share structural features
- Multi-stage decoupling networks integrated with on-package impedance matching networks for RF power amplifiers
- Asymmetric Doherty amplifier circuit with shunt reactances
- Power switching devices with high dV/dt capability and methods of making such devices
Description
Claims
The ornamental design for LED chip, as shown and described.
Referenced Cited
U.S. Patent Documents
D598871 | August 25, 2009 | Eberle et al. |
7772604 | August 10, 2010 | Duong et al. |
7855395 | December 21, 2010 | Lee et al. |
D631020 | January 18, 2011 | Chuang et al. |
7906788 | March 15, 2011 | Nagai |
D637565 | May 10, 2011 | Wu et al. |
D640643 | June 28, 2011 | Hsieh |
D642143 | July 26, 2011 | Kuwaharada et al. |
D650343 | December 13, 2011 | Andrews et al. |
D651989 | January 10, 2012 | Lin |
8119534 | February 21, 2012 | Tanaka et al. |
8210715 | July 3, 2012 | Mostoller et al. |
D673126 | December 25, 2012 | Donofrio et al. |
20080157114 | July 3, 2008 | Basin et al. |
20090039381 | February 12, 2009 | Kim et al. |
20090108281 | April 30, 2009 | Keller et al. |
20110062482 | March 17, 2011 | Solomensky et al. |
20110248289 | October 13, 2011 | Hsieh et al. |
20110260192 | October 27, 2011 | Kwak et al. |
20110278827 | November 17, 2011 | Kim et al. |
20110291154 | December 1, 2011 | Noichi et al. |
Patent History
Patent number: D689031
Type: Grant
Filed: Nov 2, 2012
Date of Patent: Sep 3, 2013
Assignee: Cree, Inc. (Durham, NC)
Inventors: Matthew Donofrio (Raleigh, NC), James Ibbetson (Santa Barbara, CA)
Primary Examiner: Selina Sikder
Application Number: 29/436,228
Type: Grant
Filed: Nov 2, 2012
Date of Patent: Sep 3, 2013
Assignee: Cree, Inc. (Durham, NC)
Inventors: Matthew Donofrio (Raleigh, NC), James Ibbetson (Santa Barbara, CA)
Primary Examiner: Selina Sikder
Application Number: 29/436,228
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)