Heat dissipating module of memory

- CompTake Technology Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a heat dissipating module of memory showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and

FIG. 8 is the other perspective view showing the heat dissipating module of memory; and,

FIG. 9 is a perspective view of the heat dissipating module of memory for reference.

The broken lines shown represent unclaimed subject matter and form no part of the claimed design.

Claims

The ornamental design for a heat dissipating module of memory, as shown and described.

Referenced Cited
U.S. Patent Documents
6377460 April 23, 2002 Pohl et al.
7215551 May 8, 2007 Wang et al.
7221569 May 22, 2007 Tsai
7312996 December 25, 2007 Chang
7391613 June 24, 2008 Lai et al.
7447024 November 4, 2008 Chou
7457122 November 25, 2008 Lai et al.
D597966 August 11, 2009 Shih
7606035 October 20, 2009 Park et al.
D609199 February 2, 2010 Chen et al.
7738252 June 15, 2010 Schuette et al.
7768785 August 3, 2010 Ni et al.
7839643 November 23, 2010 Yu
D657756 April 17, 2012 Mueller
8411443 April 2, 2013 Chen et al.
20030026076 February 6, 2003 Wei
20090122481 May 14, 2009 Chang et al.
Patent History
Patent number: D689829
Type: Grant
Filed: Jan 2, 2013
Date of Patent: Sep 17, 2013
Assignee: CompTake Technology Inc. (New Taipei)
Inventors: Wei-Hau Chen (New Taipei), Chia-Yuan Ku (New Taipei), Li-Hsu Chen (New Taipei), Hsin-An Chen (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/441,181
Classifications
Current U.S. Class: Heat Sink (D13/179)