Heat dissipating module of memory
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Description
The broken lines shown represent unclaimed subject matter and form no part of the claimed design.
Claims
The ornamental design for a heat dissipating module of memory, as shown and described.
Referenced Cited
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Patent History
Patent number: D689829
Type: Grant
Filed: Jan 2, 2013
Date of Patent: Sep 17, 2013
Assignee: CompTake Technology Inc. (New Taipei)
Inventors: Wei-Hau Chen (New Taipei), Chia-Yuan Ku (New Taipei), Li-Hsu Chen (New Taipei), Hsin-An Chen (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/441,181
Type: Grant
Filed: Jan 2, 2013
Date of Patent: Sep 17, 2013
Assignee: CompTake Technology Inc. (New Taipei)
Inventors: Wei-Hau Chen (New Taipei), Chia-Yuan Ku (New Taipei), Li-Hsu Chen (New Taipei), Hsin-An Chen (New Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/441,181
Classifications
Current U.S. Class:
Heat Sink (D13/179)