Laser processing machine
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Description
The broken lines shown are included for the purpose of illustrating the unclaimed portions of a laser processing machine and form no part of the claimed design.
Claims
The ornamental design for a laser processing machine, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
D332615 | January 19, 1993 | Fang et al. |
D489077 | April 27, 2004 | Bloch |
7013544 | March 21, 2006 | Yasuda et al. |
D518497 | April 4, 2006 | Muraoka et al. |
D636796 | April 26, 2011 | Hiroshima et al. |
D667031 | September 11, 2012 | Mueller |
1302328 | June 2007 | JP |
1442919 | June 2012 | JP |
1442955 | June 2012 | JP |
Patent History
Patent number: D690745
Type: Grant
Filed: Mar 22, 2013
Date of Patent: Oct 1, 2013
Assignees: Komatsu Industries Corporation (Kanazawa-Shi), Komatsu Ltd. (Tokyo)
Inventors: Toshihiro Koide (Tokyo), Seiichi Hayashi (Nanto), Koji Masauji (Nanto)
Primary Examiner: Patricia Palasik
Application Number: 29/450,778
Type: Grant
Filed: Mar 22, 2013
Date of Patent: Oct 1, 2013
Assignees: Komatsu Industries Corporation (Kanazawa-Shi), Komatsu Ltd. (Tokyo)
Inventors: Toshihiro Koide (Tokyo), Seiichi Hayashi (Nanto), Koji Masauji (Nanto)
Primary Examiner: Patricia Palasik
Application Number: 29/450,778
Classifications
Current U.S. Class:
Material Working, Abrading, Or Founding Machinery (D15/122)