Light emitting diode package
Latest Everlight Electronics Co., Ltd. Patents:
The illustrated embodiment is characterized by the light emitting diode package including a base and a light emitting portion assembled to the base, as shown in
Claims
The ornamental design for a light emitting diode package, as shown.
Type: Grant
Filed: Mar 31, 2012
Date of Patent: May 27, 2014
Assignee: Everlight Electronics Co., Ltd.
Inventor: Jung Chiuan Lin (New Taipei)
Primary Examiner: Marcus Jackson
Application Number: 29/417,255