Light emitting diode package

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Description

FIG. 1 is a first perspective view of a light emitting diode package incorporating a design according to an embodiment of the present disclosure;

FIG. 2 is a second perspective view thereof;

FIG. 3 is a third perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a top plan view thereof;

FIG. 9 is a bottom plan view thereof; and,

FIG. 10 is a cross-sectional view along a cross section A-A of FIG. 4.

The illustrated embodiment is characterized by the light emitting diode package including a base and a light emitting portion assembled to the base, as shown in FIGS. 1 and 5. In one embodiment, the base is generally rectangular in shape. In one embodiment, a bottom of the base includes two pads. In one embodiment, the light emitting portion is light transmissive and has an arched contour.

Claims

The ornamental design for a light emitting diode package, as shown.

Referenced Cited
U.S. Patent Documents
D634863 March 22, 2011 Leung
D667145 September 11, 2012 Bierhuizen et al.
Foreign Patent Documents
D1298733 April 2007 JP
D1387494 May 2010 JP
D1393905 August 2010 JP
D123860 July 2008 TW
D123860 August 2008 TW
D141204 June 2011 TW
Patent History
Patent number: D705957
Type: Grant
Filed: Mar 31, 2012
Date of Patent: May 27, 2014
Assignee: Everlight Electronics Co., Ltd.
Inventor: Jung Chiuan Lin (New Taipei)
Primary Examiner: Marcus Jackson
Application Number: 29/417,255
Classifications