Semiconductor device
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The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.
The ornamental design of the present disclosure is for a semiconductor device that may accommodate a circuit board on which circuit components such as power semiconductor elements are mounted.
Claims
The ornamental design for a semiconductor device, as shown and described.
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Type: Grant
Filed: Jul 16, 2013
Date of Patent: Aug 5, 2014
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Shuangching Chen (Matsumoto), Akira Iso (Matsumoto), Takashi Hyakutake (Matsumoto), Syougo Ogawa (Matsumoto), Syuuji Miyashita (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/460,862