Heat spreader on a memory module

- Corsair Memory, Inc.
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Description

FIG. 1 is a front right side perspective view of a heat spreader on a memory module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof; and,

FIG. 5 is a bottom view thereof.

The shade lines in the figures show contour and not surface ornamentation.

Claims

The ornamental design for a heat spreader on a memory module, as shown and described.

Referenced Cited
U.S. Patent Documents
6297966 October 2, 2001 Lee et al.
7365985 April 29, 2008 Ni
7382617 June 3, 2008 Yu et al.
7391613 June 24, 2008 Lai et al.
D597966 August 11, 2009 Shih
7606035 October 20, 2009 Park et al.
D610557 February 23, 2010 Chen et al.
D626520 November 2, 2010 Chen et al.
D626521 November 2, 2010 Chen et al.
8081474 December 20, 2011 Zohni et al.
D657756 April 17, 2012 Mueller
D660810 May 29, 2012 Mueller
20020039282 April 4, 2002 Han et al.
20030076657 April 24, 2003 Summers et al.
20050264998 December 1, 2005 McCutcheon et al.
20070070607 March 29, 2007 Goodwin
20070263360 November 15, 2007 Lai et al.
20090168356 July 2, 2009 Chen et al.
20100038054 February 18, 2010 Chen et al.
20100175852 July 15, 2010 Peterson
Patent History
Patent number: D717744
Type: Grant
Filed: Aug 30, 2013
Date of Patent: Nov 18, 2014
Assignee: Corsair Memory, Inc. (Fremont, CA)
Inventor: Martin Mueller (Fremont, CA)
Primary Examiner: Selina Sikder
Application Number: 29/465,650
Classifications
Current U.S. Class: Heat Sink (D13/179)