Package case
Latest Plus Meditech Co., Ltd. Patents:
Description
The differently lined areas indicate surfaces of the package case with contrasting appearances.
Claims
The ornamental design for package case, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D718125
Type: Grant
Filed: Dec 30, 2013
Date of Patent: Nov 25, 2014
Assignee: Plus Meditech Co., Ltd. (Tainan)
Inventor: Yueh-Hua Chiang (Taipei)
Primary Examiner: Susan Bennett Hattan
Assistant Examiner: Vy Koenig
Application Number: 29/478,017
Type: Grant
Filed: Dec 30, 2013
Date of Patent: Nov 25, 2014
Assignee: Plus Meditech Co., Ltd. (Tainan)
Inventor: Yueh-Hua Chiang (Taipei)
Primary Examiner: Susan Bennett Hattan
Assistant Examiner: Vy Koenig
Application Number: 29/478,017
Classifications
Current U.S. Class:
D9/432