Semiconductor wafer with dicing positions for solar cell fabrication

- Emcore Solar Power, Inc.
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Description

FIG. 1 is a top perspective view of a semiconductor wafer with dicing positions for a solar cell fabrication showing our new design;

FIG. 2 is a front side elevation view thereof;

FIG. 3 is a rear side elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevation view thereof; and,

FIG. 7 is a right side elevation view thereof.

Claims

The ornamental design for a semiconductor wafer with dicing positions for solar cell fabrication, as shown and described.

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Patent History
Patent number: D720313
Type: Grant
Filed: Jun 16, 2014
Date of Patent: Dec 30, 2014
Assignee: Emcore Solar Power, Inc. (Albuquerque, NM)
Inventors: Greg Flynn (Albuquerque, NM), Benjamin C. Richards (Albuquerque, NM)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/493,998