Module with built-in integrated circuits for use with IC card

- Kabushiki Kaisha Toshiba
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a module with built-in integrated circuits for use with IC card, showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a module with built-in integrated circuits for use with IC card, as shown and described.

Referenced Cited
U.S. Patent Documents
5031026 July 9, 1991 Ueda
D327883 July 14, 1992 Gloton
D328599 August 11, 1992 Gloton
D331922 December 22, 1992 Gloton
D335663 May 18, 1993 Gloton
D342728 December 28, 1993 Gloton
D344502 February 22, 1994 Gloton
D353135 December 6, 1994 Gloton
D353136 December 6, 1994 Gloton
D357242 April 11, 1995 Gloton
D357909 May 2, 1995 Gloton
D358142 May 9, 1995 Gloton
D365092 December 12, 1995 Mundigl et al.
D387746 December 16, 1997 Ishihara
D387747 December 16, 1997 Ishihara
D388066 December 23, 1997 Ishihara
D389130 January 13, 1998 Ishihara
D405779 February 16, 1999 Huber et al.
D406821 March 16, 1999 Fischer et al.
D406822 March 16, 1999 Huber et al.
D425519 May 23, 2000 Merlin et al.
D456414 April 30, 2002 Turin
D466093 November 26, 2002 Ebihara et al.
D471167 March 4, 2003 Ebihara et al.
D471524 March 11, 2003 Ebihara et al.
D534537 January 2, 2007 Smith et al.
D571810 June 24, 2008 Ikeda
8061625 November 22, 2011 Yu et al.
D702240 April 8, 2014 Lepp et al.
D703208 April 22, 2014 Lepp et al.
20090057417 March 5, 2009 Shinohara et al.
20100025480 February 4, 2010 Nishizawa et al.
20100176207 July 15, 2010 Yoshikawa et al.
20130084918 April 4, 2013 Sheshadri
Foreign Patent Documents
201030223483.4 April 2011 CN
899738-2 February 1995 JP
981954 May 1997 JP
Patent History
Patent number: D720354
Type: Grant
Filed: May 21, 2012
Date of Patent: Dec 30, 2014
Assignee: Kabushiki Kaisha Toshiba (Tokyo)
Inventor: Akira Komatsu (Yokohama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/422,445
Classifications
Current U.S. Class: Icu Chip (D14/437)