Housing for electronic modules with cooling fins
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Claims
The ornamental design for a housing for electronic modules with cooling fins, as shown and described.
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Type: Grant
Filed: Jan 9, 2014
Date of Patent: Feb 17, 2015
Assignee: Liebherr-Elektronik GmbH (Lindau)
Inventor: Martin Zimmer (Tettnang)
Primary Examiner: Selina Sikder
Application Number: 29/478,926