Solderless terminal

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Description

FIG. 1 is a front elevational view of a solderless terminal showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a bottom plan view thereof.

FIG. 7 is a top perspective view thereof; and,

FIG. 8 is a bottom perspective view thereof.

Claims

The ornamental design for a solderless terminal, as shown.

Referenced Cited
U.S. Patent Documents
D605138 December 1, 2009 Sogo et al.
D618179 June 22, 2010 Arai et al.
D668228 October 2, 2012 Chartrand et al.
D672317 December 11, 2012 Jibiki
Foreign Patent Documents
1243264 June 2005 JP
Patent History
Patent number: D726662
Type: Grant
Filed: Sep 24, 2014
Date of Patent: Apr 14, 2015
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Yosuke Honda (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/503,166
Classifications
Current U.S. Class: Element Or Attachment (D13/154)