Solderless terminal
Latest Japan Aviation Electronics Industry, Limited Patents:
Description
Claims
The ornamental design for a solderless terminal, as shown.
Referenced Cited
Patent History
Patent number: D726662
Type: Grant
Filed: Sep 24, 2014
Date of Patent: Apr 14, 2015
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Yosuke Honda (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/503,166
Type: Grant
Filed: Sep 24, 2014
Date of Patent: Apr 14, 2015
Assignee: Japan Aviation Electronics Industry, Limited (Tokyo)
Inventor: Yosuke Honda (Tokyo)
Primary Examiner: Daniel Bui
Application Number: 29/503,166
Classifications
Current U.S. Class:
Element Or Attachment (D13/154)