Sensor module
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United States Design application Ser. No. 29/491,674 filed May 22, 2014.
The above referenced application, and all of the subject matter disclosed therein, is incorporated herein by reference in its entirety.
The dashed broken lines are for environmental purposes only and form no part of the claimed design.
The dashed broken lines in
Any views of the sensor module that are not shown in the figures form no part of the claimed design.
Claims
The ornamental design for a sensor module, as shown and described.
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Type: Grant
Filed: May 22, 2014
Date of Patent: May 12, 2015
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Sheldon George Phillips (Glendale, CA), Frank Nuovo (Los Angeles, CA), Tom Torfs (Kraainem), Lindsay Brown (Mierlo)
Primary Examiner: Antoine D Davis
Application Number: 29/491,671