Packing bead ring for a wire coil
Latest Lincoln Global, Inc. Patents:
Description
The broken lines shown are environmental only and form no part of the claimed design.
Claims
The ornamental design for a packing bead ring for a wire coil, as shown and described.
Referenced Cited
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Patent History
Patent number: D733560
Type: Grant
Filed: Jun 25, 2013
Date of Patent: Jul 7, 2015
Assignee: Lincoln Global, Inc. (City of Industry, CA)
Inventors: Vaidyanath Bharata Rajan (Mentor, OH), Michael Whitehead (Strongsville, OH)
Primary Examiner: Patricia Palasik
Application Number: 29/459,027
Type: Grant
Filed: Jun 25, 2013
Date of Patent: Jul 7, 2015
Assignee: Lincoln Global, Inc. (City of Industry, CA)
Inventors: Vaidyanath Bharata Rajan (Mentor, OH), Michael Whitehead (Strongsville, OH)
Primary Examiner: Patricia Palasik
Application Number: 29/459,027
Classifications
Current U.S. Class:
D9/456;
Packaging Or Wrapping (D15/145)