Packing bead ring for a wire coil

- Lincoln Global, Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of a packing bead ring for a wire coil showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a side view thereof with the front, rear, left, and right views all being mirror images;

FIG. 4 is a sectional view taken along line 4-4 in FIG. 2; and,

FIG. 5 is an enlarged view of the area indicated in FIG. 1 to show further detail of the packing bead ring for a wire coil design.

The broken lines shown are environmental only and form no part of the claimed design.

Claims

The ornamental design for a packing bead ring for a wire coil, as shown and described.

Referenced Cited
U.S. Patent Documents
849164 April 1907 Roede
2553750 May 1951 Cole
2554629 May 1951 Meyer
2589107 March 1952 Marien
2610846 September 1952 Hanna
2634995 April 1953 Storey
2670255 February 1954 Bergeron
2755118 July 1956 Jarvis
3222834 December 1965 Taft
D315309 March 12, 1991 Baughman
5377999 January 3, 1995 Gorman
D370414 June 4, 1996 Lambelet, Jr.
5563738 October 8, 1996 Vance
5620775 April 15, 1997 LaPerre
6250641 June 26, 2001 Dinc et al.
6286837 September 11, 2001 Humphrey
D470790 February 25, 2003 Schmidt
D487709 March 23, 2004 Ferlise
D576067 September 2, 2008 Hines
D634604 March 22, 2011 Orihara et al.
D640155 June 21, 2011 Parvex
8181967 May 22, 2012 Feeny
D688150 August 20, 2013 Parvex
20050183973 August 25, 2005 Spater et al.
20090021024 January 22, 2009 Prabhu et al.
Patent History
Patent number: D733560
Type: Grant
Filed: Jun 25, 2013
Date of Patent: Jul 7, 2015
Assignee: Lincoln Global, Inc. (City of Industry, CA)
Inventors: Vaidyanath Bharata Rajan (Mentor, OH), Michael Whitehead (Strongsville, OH)
Primary Examiner: Patricia Palasik
Application Number: 29/459,027
Classifications
Current U.S. Class: D9/456; Packaging Or Wrapping (D15/145)