Stamp
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Description
The broken lines illustrating portions of the stamp are for environmental purposes only and form no part of the claimed design.
Claims
We claim, the ornamental design for a stamp, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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Patent History
Patent number: D750157
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Feb 23, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Hyo-In Ahn (Seoul), Eun-Kyung Yoo (Seoul), Ji-Su Jung (Yongin-si), Dong-Goo Kang (Seoul), Say Jang (Yonginsi)
Primary Examiner: Bridget L Eland
Assistant Examiner: Lauren McVey
Application Number: 29/482,214
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Feb 23, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Hyo-In Ahn (Seoul), Eun-Kyung Yoo (Seoul), Ji-Su Jung (Yongin-si), Dong-Goo Kang (Seoul), Say Jang (Yonginsi)
Primary Examiner: Bridget L Eland
Assistant Examiner: Lauren McVey
Application Number: 29/482,214
Classifications
Current U.S. Class:
Stamp, Seal Imprinter, Or Stamp Pad (D18/15)