Stamp

- Samsung Electronics
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Description

FIG. 1 is a perspective view of a stamp, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a side elevation view thereof;

FIG. 5 is a another side elevation view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines illustrating portions of the stamp are for environmental purposes only and form no part of the claimed design.

Claims

We claim, the ornamental design for a stamp, as shown and described.

Referenced Cited
U.S. Patent Documents
D247261 February 14, 1978 Hormann
D280643 September 17, 1985 Ichikawa
D280644 September 17, 1985 Ichikawa
4996921 March 5, 1991 Hong
D399245 October 6, 1998 Harden
6634288 October 21, 2003 Imamaki
D506775 June 28, 2005 Kida
6935231 August 30, 2005 Naritomi
D585932 February 3, 2009 Kida
D614688 April 27, 2010 Wilflingseder
D620973 August 3, 2010 Fukasawa
7765924 August 3, 2010 Suda
D679317 April 2, 2013 Ono
Foreign Patent Documents
3465718 August 2005 CN
302081811 September 2012 CN
3269912 December 2012 CN
2040895 December 1994 GB
D1181638 August 2003 JP
D1200252 March 2004 JP
300414571.0000 May 2006 KR
Patent History
Patent number: D750157
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Feb 23, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventors: Hyo-In Ahn (Seoul), Eun-Kyung Yoo (Seoul), Ji-Su Jung (Yongin-si), Dong-Goo Kang (Seoul), Say Jang (Yonginsi)
Primary Examiner: Bridget L Eland
Assistant Examiner: Lauren McVey
Application Number: 29/482,214
Classifications