Climate sensor

- HipScience, LLC
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Description

FIG. 1 is an upper front perspective view of the novel climate sensor.

FIG. 2 is a lower front perspective view of the sensor of FIG. 1.

FIG. 3 is an upper rear perspective view of the novel sensor of FIG. 1.

FIG. 4 is a lower rear perspective view of the novel sensor of FIG. 1.

FIG. 5 is a front side view of the sensor of FIG. 1.

FIG. 6 is a rear side view of the sensor of FIG. 1.

FIG. 7 is a right side view of the sensor of FIG. 1.

FIG. 8 is a left side view of the sensor of FIG. 1.

FIG. 9 is a top view of the sensor of FIG. 1; and,

FIG. 10 is a bottom view of the sensor of FIG. 1.

Claims

The ornamental design for a climate sensor, as shown and described.

Referenced Cited
U.S. Patent Documents
D377321 January 14, 1997 Tomizawa
D747984 January 26, 2016 Zhao
D756248 May 17, 2016 Rosenberg
D764320 August 23, 2016 Li
20120130548 May 24, 2012 Fadell
Other references
  • IoT made easy, Simplelink Sensor Tag—TI.com, retrieved May 13, 2016, http://www.ti.com/ww/en/wirelessconnectivity/sensortag2015/tearDown.htm1,3 pages.
  • Environmental and Biometric Sensor Puck with Bluetooth Low Energy and iOS/Android App, retrieved May 13, 2016, https://www.silabs.com/products/sensors/Pages/environmental-biometric-sensor-puck.aspx, 4 pages.
Patent History
Patent number: D795092
Type: Grant
Filed: May 17, 2016
Date of Patent: Aug 22, 2017
Assignee: HipScience, LLC (Orlando, FL)
Inventor: Marquette Trishaun (Orlando, FL)
Primary Examiner: Antoine D Davis
Application Number: 29/564,956