Heat sink

- ABL IP Holding LLC
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Description

FIG. 1 is a top perspective view of the heat sink.

FIG. 2 is a left side elevation view of the heat sink of FIG. 1.

FIG. 3 is a right side elevation view of the heat sink of FIG. 1.

FIG. 4 is a front elevation view of the heat sink of FIG. 1.

FIG. 5 is a rear elevation view of the heat sink of FIG. 1.

FIG. 6 is a top plan view of the heat sink of FIG. 1; and,

FIG. 7 is a bottom plan view of the heat sink of FIG. 1.

The evenly dotted broken lines in the drawings illustrate portions of the heat sink and form no part of the claimed design.

Claims

The ornamental design for a heat sink, as shown and described.

Referenced Cited
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Other references
  • Enzotech, “Enzotech's Spread Pin Heat Sink Introduction”, Accessed Jun. 26, 2017, First captured on Mar. 10, 2012. (http://www.enzotechnology.com/spreadpin.htm).
  • Embedded, “Hybrid heat sinks provide optimal cooling for embedded systems”, Accessed Jun. 26, 2017, Posted on May 20, 2009. (http://www.embedded.com/print/4027004).
  • Ledcooler, “Round Pin Fin LED Cooler, Cold Forged AL1070 LED Heatsink ”, Accessed Jun. 26, 2017, posted Apr. 12, 2014. (http://ledcooler.blogspot.com/2014/12/round-pin-fin-cooler-forged-heatsink.html).
Patent History
Patent number: D800677
Type: Grant
Filed: Aug 30, 2016
Date of Patent: Oct 24, 2017
Assignee: ABL IP Holding LLC (Decatur, GA)
Inventors: Joseph J. Onda (Lawrenceville, GA), Benjamin Marshall Suttles (Stockbridge, GA)
Primary Examiner: Jennifer Rivard
Assistant Examiner: April Rivas
Application Number: 29/575,858
Classifications
Current U.S. Class: Heat Sink (D13/179)