Electronics case

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Description

FIG. 1 is a bottom isometric perspective view of an electronics case showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view of one side thereof;

FIG. 5 is a side elevational view of the opposite side thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines shown in the figures that are immediately adjacent to the shaded areas and define unshaded regions, represent the bounds of the claim. All other broken lines are directed to portions of the electronics case. The broken lines form no part of the claimed design. The shading illustrated in the figures is provided merely to represent the contours of the design and is not intended to be illustrative of, for example, texture, material, gloss, translucence, transparency, or surface decoration.

Claims

The ornamental design for an electronics case, as shown and described.

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Patent History
Patent number: D816994
Type: Grant
Filed: Nov 10, 2016
Date of Patent: May 8, 2018
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Joshua Fischer (Shenzhen), Juyoung Kim (Shenzhen)
Primary Examiner: Cathron C Brooks
Assistant Examiner: W. A. Teddy Falloway
Application Number: 29/584,019
Classifications
Current U.S. Class: D3/294