Sealable housing for enclosing sensors
The broken lines show portions of the sealable housing that do not form part of the claimed design. The dash-dot lines define the bounds of the claimed design and form no part thereof.
As indicated herein, in implementations, the ornamental design as illustrated and claimed can be illustratively applied to a modular, waterproof housing for securely housing or enclosing one or more electronic, optical and/or other sensors and/or other components for measuring environmental data such as data related to temperature, light, moisture and/or other variables.
Claims
An ornamental design for a sealable housing for securely enclosing sensors, as shown and described.
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Type: Grant
Filed: Dec 12, 2016
Date of Patent: Aug 28, 2018
Inventors: David C. Meyerson (Chapel Hill, NC), Michael F. Prorock (Chapel Hill, NC)
Primary Examiner: Selina Sikder
Application Number: 29/587,331